Aerospace Printed Circuit Board Market Analysis | 2025-2034

Attractive Opportunities

Global Demand Analysis & Sales Opportunities in Aerospace Printed Circuit Board Market

• The annual demand for aerospace printed circuit board was USD 1.2 billion in 2024 and is expected to reach USD 1.3 billion in 2025, up 9.7% than the value in 2024.
• During the forecast period (2025 to 2034), the aerospace printed circuit board market is expected to grow at a CAGR of 2.5%. The annual demand will reach of USD 1.7 billion in 2034.
• During 2025-2034, the aerospace printed circuit board industry is expected to generate a cumulative sales opportunity of USD 15.73 billion.  
   

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High-Growth Market Segments:

• Asia-Pacific is likely to mark the highest growth, particularly driven by China and India.
• By Platform type, Commercial Aircraft is expected to lead the market with increased fleet size and new aircraft programs.
• By Product type, Rigid-flex & HDI/IC substrate boards are expected to witness high growth.
• By Laminate Material type, Polyimide-Based Laminates are expected to experience rising demand.
• By Application type, Engine Control Systems & Health Monitoring Sensors are expected to drive demand.

Market Statistics

Have a look at the sales opportunities presented by the aerospace printed circuit board market in terms of growth and market forecast.

Market Dynamics

Introduction:

What is an aerospace printed circuit board?

An aerospace printed circuit board (PCB) is a specialized type of circuit board designed for use in aerospace applications such as aircraft, satellites, spacecraft, and defense systems. These PCBs serve as the backbone for mounting and interconnecting electronic components, enabling the operation of avionics, communication systems, navigation equipment, radar, flight control, and power distribution systems.

Market Drivers:

• As airlines continue to focus on fuel efficiency and lightweight design, PCB manufacturers are adapting by developing compact, miniaturized circuit boards that reduce both space and weight without compromising functionality. At the same time, older aircraft are being upgraded with modern avionics and digital systems to meet evolving standards - driving demand for sophisticated multilayer and HDI boards capable of supporting advanced technologies.
• On the defense side, increased spending and the growing use of drones are creating opportunities for rugged, high-performance PCBs that can withstand harsh and mission-critical environments.
• Meanwhile, the rise of electric vertical take-off and landing (eVTOL) aircraft and urban air mobility platforms is opening up a new segment of demand, where lightweight and compact electronic systems are essential to performance and efficiency.

Segment Analysis

By Platform Type

“The aerospace PCB market is witnessing robust growth across platform segments, with commercial aircraft expected to maintain its dominance while UAVs and regional aircraft are likely to emerge as key drivers fueled by technological advancements and evolving defense and commercial needs.”

• The aerospace printed circuit board market is segmented into commercial aircraft, regional aircraft, general aviation, military aircraft, helicopters, spacecraft, and UAVs. Commercial aircraft is expected to lead the market, due to fleet growth and advanced digital avionics, both of which rely heavily on sophisticated PCBs.
• The regional aircraft segment is also growing, driven by popular programs such as Embraer’s E2 series and the latest turboprops from ATR, which address the increasing demand for short-haul and eco-friendly flights.

By Product Type 

“As aircraft systems continue to evolve toward higher complexity and miniaturization, the demand for advanced PCB types like HDI and rigid-flex is expected to rise significantly in the coming years.”

• The product-type segmentation of the aerospace printed circuit board market is divided into rigid 1–2-sided boards, standard multilayer PCBs, flexible PCBs, rigid-flex PCBs, high-density interconnect (HDI)/IC substrates, and other product types.
• While standard multilayer PCBs have traditionally held a dominant position due to their broad applicability and cost-effectiveness, the market seems to be gradually shifting toward more advanced formats like HDI and rigid-flex boards. 

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By Laminate Material Type 

“The growing complexity and thermal demands of modern aircraft systems are likely to drive increased adoption of polyimide-based laminates in the coming years.”

• The laminate material-type segmentation of the aerospace PCB market includes FR4, polyimide, and other specialized laminates. FR4 has long been favored for its durability and reliable electrical insulation properties, which could continue to support its widespread use in standard applications.
• However, polyimide materials appear to be gaining traction, particularly in flexible designs and high-temperature environments. As aircraft systems increasingly integrate electronics into compact and thermally sensitive areas, the demand for polyimide-based laminates may grow, given their potential to offer superior thermal and mechanical stability in critical applications.

By Application Type

“Radio communication systems are expected to dominate the applications segment, while engine control systems are likely to be the fastest growing in the upcoming years, driven by the increasing adoption of predictive maintenance and real-time monitoring in modern aircraft."

• The application-type segmentation of the aerospace PCB market is segmented into power supplies, power converters, radio communication, engine control systems, radars, health monitoring sensors, and other specialized applications.
• Aerospace PCBs are integral to a broad range of systems, ranging from power supplies and converters to communication modules, engine control units, radars, and health-monitoring sensors. Among these, engine control systems and health-monitoring applications appear to be gaining significant traction.
• With the aircraft industry showing an increasing interest in predictive maintenance and real-time digital monitoring, the demand for smarter, more integrated circuit boards is expected to rise. Additionally, the growing reliance on radio communication and satellite-based technologies may further boost the need for high-precision, high-performance PCB solutions across both military and commercial aircraft platforms.

Regional Analysis

“As global aerospace activity intensifies, regions like Asia-Pacific and Europe are likely to witness notable growth, while North America may retain its technological and production leadership.”

• Regionally, North America appears to be maintaining a leading position in the aerospace PCB market, driven by the strong presence of major OEMs such as Boeing, Lockheed Martin, and Northrop Grumman. The USA is likely to continue playing a dominant role, supported by its robust commercial and defense aircraft production capabilities.
• Meanwhile, the Asia-Pacific is showing signs of becoming the fastest-growing region, with countries like China and India potentially accelerating domestic aircraft manufacturing and defense investments. Europe may also retain a competitive edge, backed by Airbus’ ongoing R&D efforts and steady aircraft deliveries, especially on next-generation platforms.

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Competitive Landscape

Most of the major players compete in some of the factors, including price, service offerings, regional presence, etc. The following are the key players in the aerospace printed circuit board market -  

Here is the list of the Top Players (Based on Dominance)

• TTM Technologies Inc.
• Sanmina Corporation
• Amphenol Printed Circuits (a division of Amphenol Corporation)
• Eltek Ltd.
• IEC Electronics Corp. (now part of Creation Technologies)
• Advanced Circuits, Inc.
• Firan Technology Group Corporation (FTG Group)

Note: The above list does not necessarily include all the top players in the market.

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Report Features

This report provides market intelligence most comprehensively. The report structure has been kept so that it offers maximum business value. It provides critical insights into market dynamics and will enable strategic decision-making for existing market players as well as those willing to enter the market.

The following are the key features of the report:

• Market structure: Overview, industry life cycle analysis, supply chain analysis.
• Market environment analysis: Growth drivers and constraints, Porter’s five forces analysis, SWOT analysis.
• Market trend and forecast analysis.
• Market segment trend and forecast.
• Competitive landscape and dynamics: Market share, Service portfolio, New Product Launches, etc.
• COVID-19 impact and its recovery curve.
• Attractive market segments and associated growth opportunities.
• Emerging trends.
• Strategic growth opportunities for the existing and new players.
• Key success factors.

Market Segmentation

This report studies the market, covering a period of 15 years of trend and forecast. The report provides detailed insights into the market dynamics to enable informed business decision-making and growth strategy formulation based on the opportunities present in the market.

The aerospace printed circuit board market is segmented into the following categories:

By Platform-Type Analysis

• Commercial Aircraft 
• Regional Aircraft 
• General Aviation 
• Military Aircraft 
• Helicopter 
• Spacecraft 
• UAV 

By Product-Type Analysis

• Rigid 1,2-Sided 
• Standard Multilayer 
• Flexible 
• Rigid-Flex 
• High Density Interconnect 
• Other Products 

By Laminate Material-Type Analysis

• FR4 
• Polyimide 
• Other Material based Printed Circuit Boards

By Application-Type Analysis

• Power Supplies 
• Power Converters 
• Radio Communication 
• Engine Control Systems 
• Radars 
• Health Monitoring Sensors 
• Other Applications 

By Region 

• North America (The USA, Canada, and Mexico)
• Europe (Germany, France, UK, Russia, and Rest of Europe)
• Asia-Pacific (China, Japan, India, and Rest of Asia-Pacific)
• Rest of the World (the Middle East, Latin America, Others)

Research Methodology

• This strategic assessment report from Stratview Research provides a comprehensive analysis that reflects today’s aerospace printed circuit board market realities and future market possibilities for the forecast period.
• The report segments and analyzes the market in the most detailed manner in order to provide a panoramic view of the market.
• The vital data/information provided in the report can play a crucial role for market participants and investors in identifying the low-hanging fruits available in the market and formulating growth strategies to expedite their growth process.
• This report offers high-quality insights and is the outcome of a detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders, and validation and triangulation with Stratview Research’s internal database and statistical tools.
• More than 1,000 authenticated secondary sources, such as company annual reports, fact books, press releases, journals, investor presentations, white papers, patents, and articles, have been leveraged to gather the data.
• We conducted more than 15 detailed primary interviews with market players across the value chain in all four regions and industry experts to obtain both qualitative and quantitative insights.

Customization Options

With this detailed report, Stratview Research offers one of the following free customization options to our respectable clients:

Company Profiling

• Detailed profiling of additional market players (up to three players)
• SWOT analysis of key players (up to three players)

Competitive Benchmarking

• Benchmarking of key players on the following parameters: Service portfolio, geographical reach, regional presence, and strategic alliances

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