Aerospace Printed Circuit Board Market Analysis | 2024-2034

Market Insights

The aerospace printed circuit board (PCB) market was estimated at USD 1.2 billion in 2024 and is likely to grow at a CAGR of 3.3% during 2024-2034 to reach USD 1.9 billion in 2034.

Want to know more about the market scope? Register Here

Market Dynamics

Introduction

In today’s aerospace market, Printed Circuit Boards (PCBs) play a vital role in making aircraft smarter, safer, and more efficient. These boards serve as the foundation for almost all electronic systems, be it in-flight entertainment, cockpit controls, radar systems, or communication modules. Depending on the need, manufacturers use different types of PCBs, such as rigid, flexible, rigid-flex, HDI, or multilayer, each tailored for specific functions within an aircraft. Traditionally, materials like FR4 (for rigid boards) and polyimide (for flexible designs) were widely used and often combined to create rigid-flex solutions. As aircraft systems become more compact and sophisticated, there’s a growing demand for miniaturized PCBs that save space and reduce weight, both critical for improving fuel efficiency and aircraft performance.

Looking back, the period from 2019 to 2020 was tough for the aerospace industry. It faced multiple setbacks – the grounding of B737 MAX, delayed deliveries, and then the massive disruption caused by the COVID-19 pandemic. These events shook the entire supply chain, and naturally, the demand for PCBs took a hit as well. But the story in 2024 is very different.

Airbus delivered 766 commercial aircraft in 2024. Boeing, despite ongoing challenges, was also pushing through, delivering over 348 aircraft in 2024. Furthermore, despite aircraft deliveries declining in 2024, the aerospace PCB market marked healthy growth, factored in by the leading players’ stocking strategies. Severe supply chain disruptions and looming uncertainty have coerced the manufacturers to adopt a safety net in the form of stocking their inventories. This is likely to create an acute slowdown in demand in 2025.

The aircraft PCB market is evolving in some really interesting ways. One of the biggest shifts is the growing need for smaller, smarter electronics, which is pushing manufacturers toward high-density PCBs. These compact boards pack a lot of functionality into tight spaces, perfect for modern aircraft where every gram and inch matters. Rigid-flex PCBs are also becoming more popular because they offer the best of both worlds: the strength of rigid boards and the flexibility to fit into complex or tight spaces. They’re being considered more and more in critical systems like flight controls, displays, and navigation units.

What’s also exciting is how the rise of eVTOL aircraft, drones, and urban air mobility platforms is opening up new opportunities for PCB manufacturers. These next-gen aircraft rely on lightweight, efficient electronics, and PCBs play a central role in that. At the same time, with aircraft becoming more connected and digital, there’s a growing demand for boards that can handle fast data transfer, resist interference, and stay stable under pressure.

Market Drivers

As airlines continue to focus on fuel efficiency and lightweight design, PCB manufacturers are adapting by developing compact, miniaturized circuit boards that reduce both space and weight without compromising functionality. At the same time, older aircraft are being upgraded with modern avionics and digital systems to meet evolving standards - driving demand for sophisticated multilayer and HDI boards capable of supporting advanced technologies. On the defense side, increased spending and the growing use of drones are creating opportunities for rugged, high-performance PCBs that can withstand harsh and mission-critical environments. Meanwhile, the rise of electric vertical take-off and landing (eVTOL) aircraft and urban air mobility platforms is opening up a new segment of demand, where lightweight and compact electronic systems are essential to performance and efficiency.

Market Challenges

The aerospace industry operates under strict regulatory oversight to ensure the highest levels of safety and quality. For PCB manufacturers, complying with these rigorous standards, whether related to materials, manufacturing practices, or environmental guidelines can be both complex and demanding. On top of that, like many other industries, the aerospace PCB market is feeling the impact of global supply chain disruptions. Key raw materials such as copper foil and specialty laminates are becoming harder to source, lead times are increasing, and costs continue to rise. These challenges can delay production schedules and make it more difficult to stick to planned project timelines.

Recent Mergers & Acquisitions:

• In April 2024, Amphenol Corporation acquired Carlisle Interconnect Technologies: Amphenol Corporation acquired Carlisle Interconnect Technologies (CIT), a global supplier of harsh environment interconnect solutions for commercial air, defense, and industrial markets. This acquisition, valued at US$2.025 billion, enhances Amphenol's portfolio with products like cables, connectors, and sensors, strengthening its capabilities in complex aerospace applications.

• In February 2023, Advanced Printed Circuit Technologies acquired Advanced Circuits: APCT, backed by Industrial Growth Partners, acquired Advanced Circuits, a prominent PCB manufacturer. This acquisition aimed at strengthening APCT's position in the aerospace PCB market by expanding its manufacturing capabilities and customer base.

Segment Analysis

By Platform Type

“The aerospace PCB market is witnessing robust growth across platform segments, with commercial aircraft expected to maintain its dominance while UAVs and regional aircraft are likely to emerge as key drivers fueled by technological advancements and evolving defense and commercial needs.”

The aerospace printed circuit board market is segmented into commercial aircraft, regional aircraft, general aviation, military aircraft, helicopters, spacecraft, and UAVs. Commercial aircraft is expected to lead the market, due to fleet growth and advanced digital avionics, both of which rely heavily on sophisticated PCBs. The regional aircraft segment is also growing, driven by popular programs such as Embraer’s E2 series and the latest turboprops from ATR, which address the increasing demand for short-haul and eco-friendly flights. Meanwhile, the UAV market is booming, with platforms like the upgraded General Atomics MQ-9 Reaper and the rising use of AI-powered drones in defense, creating a strong need for compact, high-density PCBs. On the military side, programs like the Lockheed Martin F-35 Lightning II continue to push for rugged, reliable PCBs that can handle mission-critical operations. In space exploration, initiatives such as SpaceX’s Starship and NASA’s Artemis missions are driving innovation in lightweight, flexible PCBs that can endure extreme conditions. Even helicopters, like Sikorsky’s S-97 Raider, are adopting cutting-edge rigid-flex PCB technology to boost performance. Altogether, these programs highlight the exciting and fast-evolving trends shaping the aircraft PCB market in the upcoming years.

By Product Type 

“As aircraft systems continue to evolve toward higher complexity and miniaturization, the demand for advanced PCB types like HDI and rigid-flex is expected to rise significantly in the coming years.”

The product-type segmentation of the aerospace printed circuit board market is divided into rigid 1–2-sided boards, standard multilayer PCBs, flexible PCBs, rigid-flex PCBs, high-density interconnect (HDI)/IC substrates, and other product types. While standard multilayer PCBs have traditionally held a dominant position due to their broad applicability and cost-effectiveness, the market seems to be gradually shifting toward more advanced formats like HDI and rigid-flex boards. As aircraft systems continue to evolve and become increasingly compact and complex, demand for these higher-performance board types is likely to rise. The growing focus on weight reduction and performance enhancement, without compromising on reliability, may further accelerate the adoption of these technologies, particularly in avionics and mission-critical applications.

To get the full scope of the report, Register Here

By Laminate Material Type 

“The growing complexity and thermal demands of modern aircraft systems are likely to drive increased adoption of polyimide-based laminates in the coming years.”

The laminate material-type segmentation of the aerospace PCB market includes FR4, polyimide, and other specialized laminates. FR4 has long been favored for its durability and reliable electrical insulation properties, which could continue to support its widespread use in standard applications. However, polyimide materials appear to be gaining traction, particularly in flexible designs and high-temperature environments. As aircraft systems increasingly integrate electronics into compact and thermally sensitive areas, the demand for polyimide-based laminates may grow, given their potential to offer superior thermal and mechanical stability in critical applications.

By Application Type

“Radio communication systems are expected to dominate the applications segment, while engine control systems are likely to be the fastest growing in the upcoming years, driven by the increasing adoption of predictive maintenance and real-time monitoring in modern aircraft."

The application-type segmentation of the aerospace PCB market is segmented into power supplies, power converters, radio communication, engine control systems, radars, health monitoring sensors, and other specialized applications. Aerospace PCBs are integral to a broad range of systems, ranging from power supplies and converters to communication modules, engine control units, radars, and health-monitoring sensors. Among these, engine control systems and health-monitoring applications appear to be gaining significant traction. With the aircraft industry showing an increasing interest in predictive maintenance and real-time digital monitoring, the demand for smarter, more integrated circuit boards is expected to rise. Additionally, the growing reliance on radio communication and satellite-based technologies may further boost the need for high-precision, high-performance PCB solutions across both military and commercial aircraft platforms.

Regional Analysis

“As global aerospace activity intensifies, regions like Asia-Pacific and Europe are likely to witness notable growth, while North America may retain its technological and production leadership.”

Regionally, North America appears to be maintaining a leading position in the aerospace PCB market, driven by the strong presence of major OEMs such as Boeing, Lockheed Martin, and Northrop Grumman. The USA is likely to continue playing a dominant role, supported by its robust commercial and defense aircraft production capabilities. Meanwhile, Asia-Pacific is showing signs of becoming the fastest-growing region, with countries like China and India potentially accelerating domestic aircraft manufacturing and defense investments. Europe may also retain a competitive edge, backed by Airbus’ ongoing R&D efforts and steady aircraft deliveries, especially on next-generation platforms.

Know the high-growth countries in this report. Register Here

Key Players

Here is the list of the Top Players (Based on Dominance)

• TTM Technologies Inc.
• Sanmina Corporation
• Amphenol Printed Circuits (a division of Amphenol Corporation)
• Eltek Ltd.
• IEC Electronics Corp. (now part of Creation Technologies)
• Advanced Circuits, Inc.
• Firan Technology Group Corporation (FTG Group)

Note: The above list does not necessarily include all the top players in the market.

Are you the leading player in this market? We would love to include your name. Please write to us at [email protected]

Report Features

This report provides market intelligence most comprehensively. The report structure has been kept so that it offers maximum business value. It provides critical insights into market dynamics and will enable strategic decision-making for existing market players as well as those willing to enter the market. The following are the key features of the report:

• Market structure: Overview, industry life cycle analysis, supply chain analysis.
• Market environment analysis: Growth drivers and constraints, Porter’s five forces analysis, SWOT analysis.
• Market trend and forecast analysis.
• Market segment trend and forecast.
• Competitive landscape and dynamics: Market share, Service portfolio, New Product Launches, etc.
• COVID-19 impact and its recovery curve
• Attractive market segments and associated growth opportunities.
• Emerging trends.
• Strategic growth opportunities for the existing and new players.
• Key success factors.

The global aerospace printed circuit board market 

By Platform-Type Analysis

• Commercial Aircraft 
• Regional Aircraft 
• General Aviation 
• Military Aircraft 
• Helicopter 
• Spacecraft 
• UAV 

By Product-Type Analysis

• Rigid 1,2-Sided 
• Standard Multilayer 
• Flexible 
• Rigid-Flex 
• High Density Interconnect 
• Other Products 

By Laminate Material-Type Analysis

• FR4 
• Polyimide 
• Other Material based Printed Circuit Boards

By Application-Type Analysis

• Power Supplies 
• Power Converters 
• Radio Communication 
• Engine Control Systems 
• Radars 
• Health Monitoring Sensors 
• Other Applications 

By Region 

• North America (The USA, Canada, and Mexico)
• Europe (Germany, France, UK, Russia, and Rest of Europe)
• Asia-Pacific (China, Japan, India, and Rest of Asia-Pacific)
• Rest of the World (the Middle East, Latin America, Others)

Research Methodology

• This strategic assessment report from Stratview Research provides a comprehensive analysis that reflects today’s aerospace printed circuit board market realities and future market possibilities for the forecast period.
• The report segments and analyzes the market in the most detailed manner in order to provide a panoramic view of the market.
• The vital data/information provided in the report can play a crucial role for market participants and investors in identifying the low-hanging fruits available in the market and formulating growth strategies to expedite their growth process.
• This report offers high-quality insights and is the outcome of a detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders, and validation and triangulation with Stratview Research’s internal database and statistical tools.
• More than 1,000 authenticated secondary sources, such as company annual reports, fact books, press releases, journals, investor presentations, white papers, patents, and articles, have been leveraged to gather the data.
• We conducted more than 15 detailed primary interviews with market players across the value chain in all four regions and industry experts to obtain both qualitative and quantitative insights.

Customization Options

With this detailed report, Stratview Research offers one of the following free customization options to our respectable clients:

Company Profiling

• Detailed profiling of additional market players (up to three players)
• SWOT analysis of key players (up to three players)

Competitive Benchmarking

• Benchmarking of key players on the following parameters: Service portfolio, geographical reach, regional presence, and strategic alliances

Custom Research: Stratview Research offers custom research services across sectors. In case of any custom research requirement related to market assessment, competitive benchmarking, sourcing and procurement, target screening, and others, please send your inquiry to [email protected]