Passive and Interconnecting Electronic Components Market Analysis | 2023-2028

Passive and Interconnecting Electronic Components Market Analysis | 2023-2028

Passive and Interconnecting Electronic Components Market Analysis | 2023-2028
Report code - SRCG210 Delivery - 2 Weeks
Passive and Interconnecting Electronic Components Market Size, Share, Trend, Forecast  See more...

Market Insights

The Passive and Interconnecting Electronic Components Market was estimated at US$ 163.87 billion in 2022 and is expected to grow at a CAGR of 5.2% during 2023-2028 to reach US$ 223.39 billion by 2028.

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What are Passive and Interconnecting Electronic Components?

Passive electronic components are fundamental circuit elements that do not require an external power source for their operation. These components include resistors, capacitors, and inductors. Resistors impede the flow of electrical current, capacitors store and release electrical energy, and inductors store energy in a magnetic field.

Interconnecting electronic components facilitates the connection and communication between different parts of an electronic system. These components, such as connectors, cables, and switches, establish electrical pathways and enable the transfer of signals or power between various elements within a circuit or between different circuits. Effective interconnection is crucial for the proper functioning of electronic systems, ensuring seamless communication and power distribution between components.

Passive and Interconnecting Electronic Components Market Report Overview

Growth

5.2% for the next five years

Major Coating Type

Passive

Dominant Application Type

Consumer Electronics

Region with the highest demand

Asia-Pacific

Key Players

AVX Corporation, Hosiden Corporation., Mouser Electronics, Inc., Murata Manufacturing Co., Ltd., NICHICON CORPORATION, Panasonic Corporation, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD., TDK Corporation and Vishay Intertechnology, Inc

Market Drivers

The growing demand for passive and interconnecting electronic components is mainly due to the increasing usage of electronic devices. In addition, the surge in the adoption of smartphones and laptops in developing economies such as India and China is likely to stir the market for passive and interconnecting electronic components during the forecast period.

Segments Analysis

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By Component Type

The market is segmented as passive and interconnecting. The passive segment holds the larger share of the market and is expected to remain dominant during the forecast period. The growth of the segment is attributed to the significant demand for various types of capacitors that need to be fabricated in consumer electronic devices, industrial, and other applications.

By Application Type

The passive and interconnecting electronic components market is segmented into consumer electronics, IT & telecommunication, automotive, industrial, aerospace & defense, healthcare, and others. The consumer electronics segment leads the market owing to higher usage of several home appliances, consumer devices, mobile phones, set-top boxes (STB), and wearable devices.

Regional Analysis

In terms of regions, Asia-Pacific is estimated to be the largest as well as the fastest-growing market for passive and interconnecting electronic components during the forecast period, with China, Japan, India, and Australia being the major countries offering promising growth opportunities.

The growth of the region’s market is owing to the increasing per-capita income of countries, extensive growth of the construction industry in the region, and the presence of many passive and interconnecting electronic component manufacturers in the aforementioned countries. North America and Europe are also expected to offer substantial growth opportunities during the forecast period.

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Key Players

Some of the major passive and interconnecting electronic components manufacturers are-

  • AVX Corporation
  • Hosiden Corporation
  • Mouser Electronics, Inc.
  • Murata Manufacturing Co., Ltd.
  • NICHICON CORPORATION
  • Panasonic Corporation
  • SAMSUNG ELECTRO-MECHANICS
  • TAIYO YUDEN CO., LTD.
  • TDK Corporation
  • Vishay Intertechnology, Inc

Research Methodology

This report offers high-quality insights and is the outcome of a detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders, and validation and triangulation with Stratview Research’s internal database and statistical tools. More than 1,000 authenticated secondary sources, such as company annual reports, fact books, press releases, journals, investor presentations, white papers, patents, and articles have been leveraged to gather the data. We conducted more than 10 detailed primary interviews with the market players across the value chain in all four regions and with industry experts to obtain both qualitative and quantitative insights.

Report Features

This report provides market intelligence most comprehensively. The report structure has been kept such that it offers maximum business value. It provides critical insights into the market dynamics and will enable strategic decision-making for the existing market players as well as those willing to enter the market.

What Deliverables Will You Get in this Report?

Key questions this report answers

Relevant contents in the report

How big is the sales opportunity?

In-depth Analysis of the Passive and Interconnecting Electronic Components Market

How lucrative is the future?

The market forecast and trend data and emerging trends

Which regions offer the best sales opportunities?

Global, regional, and country-level historical data and forecasts

Which are the most attractive market segments?

Market Segment Analysis and Forecast

Who are the top players and their market positioning?

Competitive landscape analysis, Market share analysis

How complex is the business environment?

Porter’s five forces analysis, PEST analysis, Life cycle analysis

What are the factors affecting the market?

Drivers & challenges

Will I get the information on my specific requirements?

10% free customization

Customization Option

With this detailed report, Stratview Research offers one of the following free customization options to our respectable clients:

Company Profiling

  • Detailed profiling of additional market players (up to 3 players).
  • SWOT analysis of key players (up to 3 players).

Market Segmentation

  • Current market segmentation of any one of the product types by application type.  

Competitive Benchmarking

  • Benchmarking of key players on the following parameters: Product portfolio, geographical reach, regional presence, and strategic alliances.

Custom Research: Stratview Research offers custom research services across sectors. In case of any custom research requirement related to market assessment, competitive benchmarking, sourcing and procurement, target screening, and others, please send your inquiry to [email protected]

Frequently Asked Questions (FAQs)

The Passive and Interconnecting Electronic Components Market is expected to grow at a CAGR of 5.2% during 2023-2028.

AVX Corporation, Hosiden Corporation., Mouser Electronics, Inc., Murata Manufacturing Co., Ltd., NICHICON CORPORATION, Panasonic Corporation, SAMSUNG ELECTRO-MECHANICS, TAIYO YUDEN CO., LTD., TDK Corporation, and Vishay Intertechnology, Inc are among the key players in the passive and interconnecting electronic components market.

The Passive and Interconnecting Electronic Components Market is expected to reach US$ 223.39 billion by 2028.

Asia-Pacific is expected to be dominant in the passive and interconnecting electronic components market during the next five years.

The passive segment is expected to remain the dominant component type in the passive and interconnecting electronic components market.