The Advanced Packaging Market is segmented by Packaging Type (Flip-Chip, Fan-in WLP, Embedded-die, Fan-out, and 2.5D/3D), by Application Type (Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others), and by Region (North America [The USA, Canada, and Mexico], Europe [Germany, France, The UK, Russia, Italy, and Rest of Europe], Asia-Pacific [China, Japan, India, South Korea, and Rest of Asia-Pacific], and Rest of the World [Brazil, Argentina, and Others]).
The Advanced Packaging Market is segmented by Packaging Type...
“The Advanced Packaging Market is expected to grow at a promising CAGR of 7.8% during the forecast period”.
Market Dynamics
Introduction
Advanced packaging is the process of aggregating and interconnecting chips before traditional electronic packaging. It allows multiple devices, which include mechanical, electrical, or semiconductor devices, to be merged and packaged as a single electronic device. The connection of chips facilitates increased speed of electronic signals and reduced amount of energy required to drive them.
Market Drivers
Major factors such as growing demand for advanced and miniaturized semiconductor components in consumer electronics, penetration of 5G technology, and increasing utilization of Internet of Things (IoT) and connected technology across the world are expected to drive the growth of the market for advanced packaging over the coming years. In addition, governments are also promoting the adoption and utilization of IoT technologies. The transition toward More than Moore’s approach, along with continual change in nodes and wafer size, is supporting the adoption of advanced packaging in foundries.
COVID-19 Impact
The advanced packaging market faced a decline due to the wrath of the pandemic, which led to temporary shutdowns in various fabrication facilities, a dearth of fab operators and engineers, a shortage of raw materials, and difficulties in the maintenance of test operations. Furthermore, the reduction in the production capacity of consumer electronics, automotive, and other industries resulted in decreased demand for advanced packaging.
Segments Analysis
Segmentations
List of Sub-Segments
Dominant and Fastest-Growing Segments
Packaging-Type Analysis
Flip-Chip, Fan-in WLP, Embedded-die, Fan-out, and 2.5D/3D
The flip-chip segment is expected to remain the most utilized packaging type during the forecast period.
Application-Type Analysis
Consumer Electronics, Automotive, Industrial, Healthcare, Aerospace & Defense, and Others
The consumer electronics segment is estimated to remain the biggest demand generator for advanced packaging during the forecast period.
Regional Analysis
North America, Europe, Asia-Pacific, and Rest of the World
Asia-Pacific is expected to remain the largest market for advanced packaging over the forecast period.
By Packaging Type
“Flip-chip packaging is expected to remain the most popular packaging type in the forecast period”.
The market is segmented as flip-chip, fan-in WLP, embedded-die, fan-out, and 2.5D/3D. The flip-chip segment is expected to remain the most utilized packaging type during the forecast period.
The growth of the segment is driven by the increasing adoption of compact semiconductor components, which are used in high-performance applications, such as automotive and aerospace & defense. Flip-chip advanced packaging offers a small footprint along with a high input/output density.
By Application Type
“Consumer electronics will continue driving the highest demand for advanced packaging during the forecast period”.
The market is segmented as consumer electronics, automotive, industrial, healthcare, aerospace & defense, and others. Among these application types, the consumer electronics segment is estimated to remain the biggest demand generator for advanced packaging during the forecast period.
Advanced packaging is in high demand for smartphones and smartwatches as it provides multi-function integration, improved reliability, increased chip connectivity, and reduced packaging size. Furthermore, the growing trend of compact devices would contribute to the segment's significant growth in the coming years.
Regional Analysis
“Asia-Pacific is expected to remain the dominant market for advanced packaging throughout the forecast period”.
The market is broken down geographically into areas like North America, Europe, Asia-Pacific, and the Rest of the World (RoW). In terms of regions, Asia-Pacific is expected to remain the largest market for advanced packaging over the forecast period. The region's major countries, such as China, Taiwan, and South Korea, are increasing their production of semiconductor components and consumer electronic gadgets, which is increasing the region's share of the global market.
The region also includes some of the major foundry providers, such as Global Foundries, UMC, and TSMC, among others, fast-tracking market expansion opportunities. North America and Europe are also expected to offer substantial growth opportunities during the forecast period.
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Key Players
Most of the companies are leveraging their innovation capabilities to gain competitive advantage in the market.
The following are the key players in the Advanced Packaging Market (arranged alphabetically)
ASE Group
Amkor Technology, Inc.
ChipMOS Technologies Inc.
Chipbond Technology Corporation
Greatek Electronics Inc.
JCET Group Co. Ltd.
Powertech Technology Inc.
Sanmina Corporation
Siliconware Precision Industries Co. Ltd.
UTAC
Note: The above list does not necessarily include all the top players in the market.
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Report Features
This report provides market intelligence in the most comprehensive way. The report structure has been kept such that it offers maximum business value. It provides critical insights into the market dynamics and will enable strategic decision-making for the existing market players as well as those willing to enter the market.
What Deliverables Will You Get in this Report?
Key questions this report answers
Relevant contents in the report
How big is the sales opportunity?
in-depth Analysis of the Advanced Packaging Market
How lucrative is the future?
The market forecast and trend data and emerging trends
Which regions offer the best sales opportunities?
Global, regional, and country-level historical data and forecasts
Which are the most attractive market segments?
Market segment analysis and Forecast
Which are the top players and their market positioning?
Porter’s five forces analysis, PEST analysis, Life cycle analysis
What are the factors affecting the market?
Drivers & challenges
Will I get the information on my specific requirement?
10% free customization
Research Methodology
This report offers high-quality insights and is the outcome of a detailed research methodology comprising extensive secondary research, rigorous primary interviews with industry stakeholders, and validation and triangulation with Stratview Research’s internal database and statistical tools.
More than 1,000 authenticated secondary sources, such as company annual reports, fact books, press releases, journals, investor presentations, white papers, patents, and articles have been leveraged to gather the data.
We conducted more than 15 detailed primary interviews with the market players across the value chain in all four regions and with industry experts to obtain both qualitative and quantitative insights.
Report Customization Options
With this detailed report, Stratview Research offers one of the following free customization options to our respectable clients:
Company Profiling
Detailed profiling of additional market players (up to three players)
SWOT analysis of key players (up to three players)
Competitive Benchmarking
Benchmarking of key players on the following parameters: Product portfolio, geographical reach, regional presence, and strategic alliances.
Custom Research:
Stratview research offers custom research services across sectors. In case of any custom research requirement related to market assessment, competitive benchmarking, sourcing and procurement, target screening, and others, please send your inquiry to sales@stratviewresearch.com.
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The increasing demand for advanced and miniaturized semiconductor components in consumer electronics, penetration of 5G technology, and increasing adoption of IoT and AI technology, are expected to drive the growth of the market in the coming five years.
Asia-Pacific is estimated to remain the dominant region in the advanced packaging market in the coming years. Increasing production of semiconductor components and consumer electronic devices in China, Taiwan, and South Korea would drive the overall region’s market dynamics.
Consumer electronics application type is likely to maintain its dominance in the market in the next five years on account of the increasing trend of compact electronic devices.
Amkor Technology, Inc., ASE Group, JCET Group Co. Ltd., Powertech Technology Inc., Sanmina Corporation, Chipbond Technology Corporation, ChipMOS Technologies Inc., UTAC, Greatek Electronics Inc., and Siliconware Precision Industries Co. Ltd. are some of the key players in the market.
